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Note: Cover may not represent actual copy or condition available. Adhesion Measurement of Films and Coatings, Vol. Brill Academic Publishers. Now coming to this volume, it contains a total of 20 papers. It must be re- corded here that all manuscripts were rigorously peer reviewed and suitably modi- fied some twice or thrice before inclusion in this book. So this book is not merely a collection of unreviewed papers but represents the highest standard of a publication. The topics covered include: measurement and analysis of interface adhesion; relative adhesion measurement for thin film structures; adhesion testing of hard coatings by a variety of techniques; challenges and new directions in scratch adhesion testing of coated substrates; application of scratch test to differ- ent films and coatings; evaluation of coating- and substrate adhesion by indenta- tion experiments; measurement of interfacial fracture energy in multifilm appli- cations; laser induced decohesion spectroscopy LIDS for measuring adhesion; pulsed laser technique for assessment of adhesion; blade adhesion test; JKR adhe- sion test; coefficient of thermal expansion measurement; and residual stresses in diamond films.
Yours truly sincerely hopes that this book, along with its predecessor [ 11, will provide a commentary on the current state of the art anent adhesion measurement of films and coatings and will further provide a fountainhead for new ideas. First, I am thankful to Dr Robert H. Lacombe, my colleague and friend, in helping to organize this symposium by taking care of a myriad of details entailed in such an endeavor.
My sincere thanks go to the reviewers for their time and efforts in providing valuable comments which are sine qua non to maintain the highest standard of a publication. Without the contribution, interest and enthusiasm of the authors, this book could not be embodied and my thanks to all the contributors. Last, but not least, my appreciation is extended to the staff of VSP for the job well done in producing this book.
Mittal ed. Testing the adhesion of hard coatings including the non-destructive technique of surface acoustic waves H. OllendorJ T. Schulke and D. Scratch adhesion testing of coated surfaces - Challenges and new directions J , Meneve, H. Ronkainen, P. Andersson, K. Vercammen, D. Camino, D. Teer, J. Gee, N. Jennett, J. Banks, B. Bellaton, E. Matthaei-Schulz and H. Vetters Holbery and R. Scratch adhesion testing of iianophase diamond coatings on industrial substrates F. Davanloo, C. Collins and K. Scratch test failure modes and performance of organic coatings for marine applications S.
Bull, K. Howathova, I. Gilbert, D. Mitchell, R. Davidson and J. White An energetic approach for the evaluation of adhesion of sputter deposited TIC films on glass by the scratch test A. Kinbara, A. Sato, E. Kusano and N. Measurement of interfacial fracture energy in microelectronic multifilm applications J. Hay, E. Liniger and X. Assessment of adhesion reliability for plastic flip-chip packaging X.
Dai, M. Brillhart and P. Improvement and testing of diamond film adhesion X. He, H. Shen, Z. Zhang, X. Hu and X.
Evaluation of a pulsed laser technique for the estimation of the adhesion strength of oxide coatings onto metallic substrates G. Rosa, P.
Adhesion Aspects Of Thin Films - PDF Free Download
Psyllaki and R. The blade adhesion test applied to polyimide films onto silicon substrate S. Khasawinah and C. Raman spectroscopic determination of residual stresses in diamond films Q. Fan, J. Grdcio and E. Abstract-A protocol for quantitative adhesion measurements would allow implementation of de- sign codes and durability models for multi-layer devices.
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The mechanics underlying the adhesion energy is largely complete. Test methods capable of providing the necessary information are at an advanced stage of development, but future innovation and analysis are still needed before a fully- integrated methodology can be prescribed.
The status of the test methods is described and related to the overall goal. Models that allow adhesion to be related to the fundamentals of bond rupture and plasticity are examined, inclusive of concepts that inter-relate quantum mechanics results to adhe- sion measurements made at the continuum level. The additional effort needed to coalesce these models into a predictive tool is discussed. The latter has the same role as the fracture toughness in homogeneous materials [ The former includes effects of defects and of stress concentrations especially at free edges  and is thus test specific and inherently stochastic.
While both are important, here, the energy den- sity is emphasized, since it is amenable to quantitative comparison with mecha- nisms and models [2, and moreover, in principle, the measurements can be used explicitly in design codes and durability models for multi-layer systems. That is, a methodology similar to fracture mechanics-based design of structural compo- nents [ could be used subject to the construct of the appropriate numerical code [ This prospect can only be realized if the test methods yield quantitative meas- ures of rz.
Accordingly, the emphasis of this brief overview is on a pathway toward a quantitative design strategy applicable to multi-layer systems. Since the likelihood of establishing a successful strategy would be enhanced if a mechanistic basis is established, a complementary theme is the development of. A summary of this infor- mation Fig. Clean interfaces devoid of reaction prod- ucts are inherently tough and ductile. Such high adhesion is realized even though the metals are polycrystalline and non-epitaxial.
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When failure occurs, it does so either by brittle cracking in the oxide or by ductile fracture in the metal. Broad ranges have been cited for most other interfaces, because of embrittling effects of contaminants and segregants. Stress corrosion due to the presence of moisture in the test environment exacerbates weakening in some cases. Figure 1. The range of toughness found between various metals and A1,0, , Note that many results reside in discrete domains that depend on "cleanliness".
Two fundamentally important factors cause cracks at interfaces to differ from those in homogeneous materials . These differences are fundamentally related to the first Dundurs' parameter:. The subscripts 1 and 2 refer to the two adjoining materials.